Water-cooled heat sinks are crucial components that significantly affect the function and service life of power electronics components. They are used to dissipate heat from specific semiconductors, minimize power losses during operation and protect power electronics components from overheating and failure. By constantly developing new technologies, DAU ensures that the latest semiconductors efficiently deliver top performance even under extreme conditions.
We offer customers a variety of individual air-cooled heat sink solutions. Our thermal design engineers help you find the optimal design. We develop extrusions and bonded-fin heat sinks with different joining processes and designs to customer specifications for specific applications. We are also happy to deliver customized assemblies. Our goal is to provide you with the optimal heat sinks for the success of your product or project.
DAU has many years of experience in the development and production of heat pipes. Products range from standard cylindrical heat pipes to customer-specific HP assemblies. For applications with higher thermal requirements and where conventional air cooling reaches its limits, the compact design of DAU heat pipe assemblies results in optimal cooling using forced or natural convection.