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Water-cooled heat sinks

Water-cooled heat sinks are crucial components that significantly affect the function and service life of power electronics components. They are used to dissipate heat from specific semiconductors, minimize power losses during operation and protect power electronics components from overheating and failure. By constantly developing new technologies, DAU ensures that the latest semiconductors efficiently deliver top performance even under extreme conditions.

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Vacuum brazed (VBA)

Vacuum brazed coldplates offer complete design versatility by which the highest performing and optimized coldplates can be achieved.

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Vacuum brazed coldplates offer complete design versatility by which the highest performing and optimized coldplates can be achieved. Either pre-fabricated fin structures can be brazed into pockets, or unique channel configurations can be precisely machined into either aluminum or copper plates to the targeted regions where the most demanding cooling requirements are needed. The availability of folded fins for this heat sink type also expands the performance offering to the unique folded fin types that offer enhanced performance such as lanced/offset and wavy/ruffle fins.

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Product Data Sheet

IGBT

Series KW

The KW is a modular coldplate series which has been developed to address the requirement of an economical, high power liquid-cooled solution for multitude of standard high power IGBT configurations.

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The KW is a modular coldplate series which has been developed to address the requirement of an economical, high power liquid-cooled solution for multitude of standard high power IGBT configurations. This solution series is comprised of a main extruded body and two end caps that provide the desired flow routing. A variety of main bodies are available, which are selected according to the particular flow and cooling needs, and position requirements of the modules. In this series, however, the modules are not recommended to straddle the end caps.

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Product Data Sheet

Series KS

The KS series further expands the options for economical, high-powered liquid-cooled solutions for a multitude of standard high power IGBT configurations.

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The KS series further expands the options for economical, high-powered liquid-cooled solutions for a multitude of standard high power IGBT configurations. This series draws largely from a bank of standard extruded bases, and then by a unique configuration of plugs and I/O fittings, resolves the required flow routing to achieve the necessary thermal performance. A variety of standard extrusions are available, which are selected according to the particular flow and cooling needs, and position requirements of the modules. However, if no standard extrusion is suitable, it is also possible to gun-drill the required channel pattern into the plate, which is an approach of complete design flexibility. In this series, the modules can be positioned closer to the coldplate edges as there are no end caps to be concerned with.

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Product Data Sheet

Series embeeded Pipes (KL/KLD/KP)

For applications requiring a flow material other than aluminum, there are various forms of copper or stainless steel embedded pipe solutions.

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For applications requiring a flow material other than aluminum, there are various forms of copper or stainless steel embedded pipe solutions. Precision tube forming capabilities allows virtually unlimited configuration possibilities for optimum targeted thermal performance. Several methods of fabrication are available including tube expansion (for copper tubes) and tube compression, both providing optimum metal to metal contact without the use or necessity of a bonding agent.

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Vacuum brazed (VBA)

Vacuum brazed coldplates offer complete design versatility by which the highest performing and optimized coldplates can be achieved.

More
Vacuum brazed coldplates offer complete design versatility by which the highest performing and optimized coldplates can be achieved. Either pre-fabricated fin structures can be brazed into pockets, or unique channel configurations can be precisely machined into either aluminum or copper plates to the targeted regions where the most demanding cooling requirements are needed. The availability of folded fins for this heat sink type also expands the performance offering to the unique folded fin types that offer enhanced performance such as lanced/offset and wavy/ruffle fins.

Downloads

Resistor

Series KW

The KW is a modular coldplate series which has been developed to address the requirement of an economical, high power liquid-cooled solution for multitude of standard high power IGBT configurations.

More
The KW is a modular coldplate series which has been developed to address the requirement of an economical, high power liquid-cooled solution for multitude of standard high power IGBT configurations. This solution series is comprised of a main extruded body and two end caps that provide the desired flow routing. A variety of main bodies are available, which are selected according to the particular flow and cooling needs, and position requirements of the modules. In this series, however, the modules are not recommended to straddle the end caps.

Downloads

Product Data Sheet

Series KS

The KS series further expands the options for economical, high-powered liquid-cooled solutions for a multitude of standard high power IGBT configurations.

More
The KS series further expands the options for economical, high-powered liquid-cooled solutions for a multitude of standard high power IGBT configurations. This series draws largely from a bank of standard extruded bases, and then by a unique configuration of plugs and I/O fittings, resolves the required flow routing to achieve the necessary thermal performance. A variety of standard extrusions are available, which are selected according to the particular flow and cooling needs, and position requirements of the modules. However, if no standard extrusion is suitable, it is also possible to gun-drill the required channel pattern into the plate, which is an approach of complete design flexibility. In this series, the modules can be positioned closer to the coldplate edges as there are no end caps to be concerned with.

Downloads

Product Data Sheet

Series embeeded Pipes (KL/KLD/KP)

For applications requiring a flow material other than aluminum, there are various forms of copper or stainless steel embedded pipe solutions.

More
For applications requiring a flow material other than aluminum, there are various forms of copper or stainless steel embedded pipe solutions. Precision tube forming capabilities allows virtually unlimited configuration possibilities for optimum targeted thermal performance. Several methods of fabrication are available including tube expansion (for copper tubes) and tube compression, both providing optimum metal to metal contact without the use or necessity of a bonding agent.

Downloads

Vacuum brazed (VBA)

Vacuum brazed coldplates offer complete design versatility by which the highest performing and optimized coldplates can be achieved.

More
Vacuum brazed coldplates offer complete design versatility by which the highest performing and optimized coldplates can be achieved. Either pre-fabricated fin structures can be brazed into pockets, or unique channel configurations can be precisely machined into either aluminum or copper plates to the targeted regions where the most demanding cooling requirements are needed. The availability of folded fins for this heat sink type also expands the performance offering to the unique folded fin types that offer enhanced performance such as lanced/offset and wavy/ruffle fins.

Downloads