Reliably dissipate waste heat from IGBTs and MOSFETs.
Power semiconductors generate waste heat. If this heat is not dissipated, component temperatures can rise above the permissible range.
Water-cooled heat sinks dissipate this heat directly into a liquid medium via a cooling plate. This medium efficiently transports the heat out of the system.
You get everything from simulation to final testing from a single source. No external testing service provider is needed
Vacuum brazing, FSW welding, drilled profiles, and radiators with tube coils. Miba selects the technology that best suits your application.
Miba manufactures according to your drawings or develops a cooling solution based on your specifications.
Air cooling works until the heat load becomes too high or the installation space becomes too small.
Water-cooled heat sinks transfer heat much more efficiently because the cooling medium has a higher thermal capacity than air.
The choice of cooling technology depends on thermal requirements, installation space, and environmental conditions. This overview helps you make an initial assessment.
| Air cooling | Liquid cooling | |
| Heat dissipation under high thermal demands | Limited | Suitable |
| Installation space | Larger | Compact |
| Coolant | Air | Pure water or water-glycol mixtures |
Have the requirements reviewed.
Miba manufactures water-cooled heat sinks using four different technologies. The choice depends on your requirements regarding, for example, heat dissipation, cooling medium, and installation space.
Vacuum-brazed cooling plates enable precisely milled internal structures with minimal thermal resistance. They are suitable for applications with the most demanding requirements for cooling performance, leak tightness, and explosion resistance, such as IGBT, IGCT, and SiC MOSFET semiconductor modules.
Burst pressure up to over 3,650 psi (over 250 bar), no flux required, minimal warpage.
Download: Product Data Sheet VBA
FSW cooling plates join the base body and cover plate without melting the material. This reduces warpage and porosity. Custom channel geometries can be manufactured with consistent results. They are suitable for applications with high cooling performance requirements.
Suitable for, among others, IGBTs and MOSFETs in inverter, traction, and power applications.
Friction Stir Welded (FSW) Water-Cooled Heat Sinks FSW cooling plates join the base body and cover plate without melting the material. This reduces warpage and porosity. Custom channel geometries can be manufactured consistently. They are suitable for applications with high cooling performance requirements. Suitable for, among others, IGBTs and MOSFETs in inverter, traction, and power applications.
Drilled water-cooled heat sinks are manufactured from aluminum profiles with customer-specific dimensions and water channels.
Suitable for IGBTs and high-power resistors, among other applications.
Tubed cold plates consist of copper or stainless steel tubes embedded in an aluminum base plate.
Suitable for applications with special fluid or corrosion requirements.
Miba manufactures water-cooled heat sinks in two ways:
The Solution Team supports the entire process: CFD simulation, design, manufacturing, and testing (such as IGBT testing, helium leak testing, pressure drop testing, IR imaging, and mechanical validation).
Talk to the Solution Team!
Depending on requirements, each water-cooled heat sink can undergo a defined test program prior to shipment. Miba can test thermal performance, leak tightness, and mechanical strength in its own testing facility.
Water-cooled heat sinks are used in applications where power electronics must remain within the permissible temperature range at all times.
Jedes Projekt ist individuell, daher lässt sich die Entwicklungszeit nicht pauschal festlegen.
Sie hängt unter anderem von der technischen Komplexität, den Spezifikationen und den gewünschten Validierungsschritten ab. Sobald wir Ihre Anforderungen kennen, bewerten wir diese gemeinsam mit unserem Solution Team und geben Ihnen eine fundierte Einschätzung, natürlich unter Berücksichtigung Ihrer Projektzeitschiene.
Nach Eingang Ihrer Anforderungen analysieren wir diese gemeinsam mit unserem Solution Team und erstellen eine erste Einschätzung hinsichtlich technischer Umsetzung, Entwicklungsaufwand und möglicher Projektzeitschiene
Ja. Miba fertigt sowohl Prototypen als auch Klein- und Großserien. Die Stückzahl wird bei der Auslegung berücksichtigt.
Die eingesetzten Prüfverfahren, darunter IGBT-Prüfung, Bubble-Test, Helium-Lecktest, Druckverlustprüfung und mechanische Validierung, folgen definierten Prüfplänen.
Welche Testabläufe für Ihre Anwendung relevant sind, klärt das Solution Team im Rahmen der Projektspezifikation.
Je nach Anwendung kann eine Kombination sinnvoll sein. Miba bewertet auf Basis Ihrer Randbedingungen, welche Technologie oder Kombination die beste thermische Performance liefert.
Ja. Miba kann auf Basis einer vorhandenen Zeichnung oder Spezifikation eine gleichwertige oder optimierte Kühlplatte entwickeln und fertigen.
Mögliche Oberflächenbehandlungen hängen vom Werkstoff und der Anwendung ab. Für konkrete Anforderungen steht das Solution Team zur Verfügung.
