Our Heat Pipe Cooling Tower is a vertical cooling system for power semiconductors such as SiC, GaN and MOSFET. It combines a compact design with high heat absorption capacity. It is particularly suitable for industrial systems, mobility solutions and systems with high power density. Even in retrofit applications, it delivers stable thermal results under constant installation conditions.
Heat pipes transport heat from the base plate to the cooling fins with minimal loss. This keeps the temperature of the electronic components stable, even at high power densities.
The vertical design of our heat pipe cooling tower saves valuable space. Ideal for applications with limited installation space and high heat generation.
The structure is mechanically stable and requires no moving parts or additional cooling media, nor the necessary infrastructure such as pumps or heat exchangers.
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More powerful semiconductors such as SiC, GaN and MOSFETs are revolutionizing applications, but they generate massive amounts of heat. The space available for heat sinks also often remains unchanged.
This results in numerous problems, which our Heat Pipe Cooling Tower can solve:
The Heat Pipe Cooling Tower has been specially developed for applications where high power loss meets limited installation space. The high heat flux density of these components is absorbed by the base plate and the heat pipes and then dissipated evenly via the fins.
The vertical design utilizes the height instead of the surface area and thus creates thermal performance without additional volume. The integrated heat pipes transport heat quickly and evenly into the fin body, where it is released into the environment.
Thanks to the fully soldered construction of the Heat Pipe Cooling Tower, the system does not require pumps or cooling media. It operates silently, is maintenance-free and impresses with its long service life, even in continuous operation and with changing thermal loads.
Design features
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The Heat Pipe Cooling Tower is the perfect solution for a variety of demanding applications in different sectors. From industry to mobility, the compact and powerful cooling system always ensures the necessary temperature control, even for the most demanding requirements. These are the areas of application.
![[Translate to English:] Icon Industrieanlagen](/fileadmin/_processed_/6/b/csm_Industrieanwendungen_e582ee9e24.png)
Ideal for cooling power semiconductors in high-performance devices such as converters, power supply units and frequency converters.
Perfect for power electronics in electric vehicles, charging systems and battery management systems.
Cooling of inverters and other power components in photovoltaic, wind power and battery power storage systems.
It enables higher performance with the same or less installation space. Thanks to the flexible design and size of the Heat Pipe Cooling Tower, it is ideal for integration into existing systems and devices.
Various high-performance semiconductor modules can be cooled efficiently with the Heat Pipe Cooling Tower.
For example, thermal resistances of <48K/kW can be achieved on the module size described below.
Applied module size: 62 x 122 mm
Number of modules: 6
Power per module: 600 W
Total power losses: 3600 W
The installation space can be adapted to existing conditions for retrofit applications. There are virtually no limits to the size and shape of the Heat Pipe Cooling Tower, which contributes to a wide range of applications for this highly efficient solution.
