Miba Cooling offers heat sinks for power electronics designed to efficiently dissipate waste heat from power semiconductors such as IGBTs, MOSFETs, and modules, as well as from local thermal hotspots.
We manufacture according to customer drawings or work with you to develop the right solution.
The portfolio includes:
• Heat pipes & assemblies
• Air cooling solutions
• Water cooling solutions
• Cooling assemblies
Heat sinks for power electronics in air, heat pipe and liquid cooling systems. From individual components to ready-to-install assemblies.
If air cooling requires too much space, hotspots limit continuous power output or increasing power density overwhelms the existing cooling system
Every cooling solution undergoes thermal and mechanical validation. Development and manufacturing take place in Europe. All processes are carried out under one roof.
Miba Cooling supports you from the initial thermal design of your heat sinks for power electronics all the way to the finished production solution. Engineering support, manufacturing, and testing are all provided from a single source.
The benefits at a glance:
Our thermal engineers would be happy to advise you.
Request a consultation now!
Heat transfer is more than 25 times higher than when using solid copper. Available as a single heat pipe, embedded heat pipe, vacuum chamber or heat pipe assembly.
Air-cooled heat sinks for power electronics, featuring optimized fin and base materials for high cooling performance in a compact design.
Liquid-cooled cold plates with minimal thermal resistance. Available in vacuum-brazed, drilled, friction stir-welded, or embedded tube series.
Ready-to-install heat sink assemblies for electronic components with high-power resistors, all from a single source. Faster time-to-market.
Miba Cooling heat sinks for power electronics are used wherever power electronics must reliably remain within a specific temperature range.
If air cooling is no longer sufficient to handle the thermal load, a heat pipe solution or liquid cooling is the next step. Heat pipes are particularly effective at addressing localized hotspots.
Our Solution Team can help you choose the right heat sink for your electronics.
We design and manufacture heat sinks for electronics such as IGBT, IGCT, SiC, and GaN modules as well as power resistors.
Depending on the requirements, we use air-cooled heat sinks, liquid-cooled heat sinks (cold plates), heat pipes or custom assemblies.
The selection depends on power dissipation, maximum component temperature, installation space, environmental conditions, noise limits and service concept.
We can help you quickly find the right technical solution.
Yes. We supply ready-to-install cooling assemblies - such as high-power resistors mounted on heat sinks - as plug-and-play solutions directly from our facility.
Yes. Upon request, we can guide you through the entire process, from the concept phase through to validation. This includes thermal design, simulation, design iteration, prototyping and testing.
Both options are possible. The turnaround time depends on the complexity, quantity, material and scope of testing. In any case, a quick turnaround is possible, as we have the entire value chain for manufacturing heat sinks for electronics in-house.
