When air cooling isn’t enough & liquid cooling isn’t an option
Heat Pipe Cooling efficiently dissipates heat from hotspots passively, without the need for pumps or moving parts.
Miba manufactures according to the build-to-print principle based on your drawings, or works with you to develop a customized solution—including simulation, validation, and transition to series production—all from a single source.
Manufactured in Europe.
Heat pipe cooling achieves very high and uniform thermal conductivity. It specifically reduces local hotspots and smooths out temperature spikes.
Heat is transferred through the evaporation and condensation of the working fluid, without an external energy source or moving parts.
Miba supports the entire development process: from thermal design (including CFD simulation) through validation and prototyping all the way to the transition to series production. Everything from a single source.
If any of these criteria apply to your application, two phase cooling is a particularly suitable solution:
Our thermal engineers will advise you and analyze your specific application.
Request a consultation now!
Heat pipes passively transfer heat from the hotspot to the cooling surface, bridging the gap between conventional air cooling and liquid cooling. Available in diameters of 4–18 mm, lengths of 50–750 mm, and in round, flat, or bent configurations.
Embedded heat pipes are integrated directly into the heat sink. They absorb heat locally at the hotspot and distribute it over a larger area, thereby reducing temperature spikes and enabling more compact designs.
The Heat Pipe Cooling Tower is a vertically configured, passively operated cooling system for SiC, GaN, and IGBT modules. Compared to conventional air cooling, it achieves up to 27% higher thermal performance.
